|
During my visit at CES this year, I came
across the CoolIT booth which was displaying some products that were
certainly highlighted in a majority of coverage articles. From their
now popular beverage cooler to their prototype of their liquid cooling kit
for the Xbox 360, they certainly made a lasting impression at the show for
many.
However, one product that I found in at least two of the most impressive
display cases at the show was their Freezone Liquid CPU Cooler. This
high performance liquid cooling CPU cooler is unlike any other
self-contained cooling kit on the market and uses an innovative method in
order to provide maximum cooling performance. Instead of a radiator
typically found in similar products, it uses a proprietary "Chiller" that
features multiple TECs (also known as pelts or peltiers) to chill the
special glycol coolant already contained in the kit itself. Sounds
impressive? Let's take a thorough look at its features and
performance.
Packaging & Contents
|
**click to enlarge** |
**click to enlarge** |
The kit is very well packaged and includes the
all of the following:
-Chiller Module
-Fluid Heat Exchanger (CPU block)
-Chiller Module Screws
-AMD Retention Bars
-Intel 478 Retention Bars
-12cm Fan Adapter Kit
-Tightening Tool
-Intel 775 Retention Bars
-Thumb Screws
-Motherboard Standoffs
-Gigabyte Motherboard Standoffs
-Thermal Control Module (PC board)
-Detailed Installation Guide (with pics)
As you can see, plenty of hardware is included
to provide a high level of compatibility. Also note that while their
website does not state support for Intel Socket 478 motherboards, it does
include the proper retention brackets for these older system builds.
Specifications
CPU FHE (Fluid Heat Exchanger):
Design Monolithic copper, multi-cell, single channel
Dimension 42 x 42 x 17 mm
Weight 195g
TCM (Thermal Control Module):
Design Dual IC SMT PCB w/outboard IC sensor
Input 12VDC, 5VDC
Weight 89 x 53 mm
Function Thermal controller to adjust TEC and fan power output
Chiller and Pump Module:
Heatsink:
Design Dual dissipation plate, anodized alloy, laminar flow array
Dimension 89 x 53 mm
Weight 850g
TECs:
Design Six solid-state heat pump wafers
Dimension 40 x 40 x 3.5 mm (each)
Weight 20g (each)
Function Active coolant thermal reduction
Chiller FHE’s:
Design Dual anodized alloy distribution, multi-channel w/laminar flow
Dimension 121 x 41 x 12 mm (each)
Weight 80g (each)
Fan:
Noise 26dBA – 37dBA
Bearing Type Enhanced life ceramic
Life Cycle 50,000 hrs
Dimension 92 x 92 x 25 mm
Function Heatsink convection, chassis exhaust
Pump and Reservoir:
Design 12VDC coreless outrunner pump w/integrated expansion vessel
Bearings Dual in fluid sapphire bearings
Noise <15dBA
Life Cycle 50,000 hrs
Dimension 50 x 50 x 75 mm
Weight 360g
|
